The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications.

Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Not all PCB manufacturers approach NCVF in the same manner. Designers who thoroughly understand the process will have more confidence that their designs will be manufactured to meet requirements.